Nanometer scale high-aspect-ratio trench etching at controllable angles using ballistic reactive ion etching
نویسندگان
چکیده
منابع مشابه
High Aspect-ratio Nanoscale Etching in Silicon Using Electron Beam Lithography and Deep Reactive Ion Etching (drie) Technique
This work is dedicated to my dear grandmother, who has not only taught me that learning is a lifelong matter, but has also inspired me by being an example herself even at the age of 80. for the help on design and modeling; and all the members of the IMEMS group for creating a collaborative and pleasant atmosphere. Special thanks to all the MiRC Cleanroom staff, who I am greatly indebted to, for...
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ژورنال
عنوان ژورنال: Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena
سال: 2013
ISSN: 2166-2746,2166-2754
DOI: 10.1116/1.4773919